Nokota 系統的高生產率晶圓級封裝設備提供業界最佳性能，適用於多樣封裝方案中採用的所有電鍍步驟，因此擴展了應用材料公司的電氣化學沉積系統套件；其中涵蓋了從覆晶和晶圓級晶片規模封裝到 2D 和 3D 扇出、2.5D 中介層設計和矽穿孔等各種封裝方案。這些系統可用於...
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缺陷評估、分類和分析是對生產工序每個步驟實施品質監控所採用的方式，對半導體製造至為重要。隨著半導體元件線寬尺寸的縮減，元件複雜度不斷提高，缺陷的尺寸也在收縮，使其在 3D 元件結構中的位置越來越難以發現，因此需要不斷增強成像能力，以快速識別相關的關鍵缺陷。...
隨著積體電路及其組件持續向下微縮，組件之間的金屬導線和接觸點的尺寸也在縮小。這種趨勢造成這些連接組件的電阻越來越高。為生產更精小、更快速的電子元件，連接組件必須維持最小電阻，元件才可能進一步微縮。
這種較高電阻所造成的慢化效應通常稱作阻容延遲 (即 RC 延遲...
In semiconductor manufacturing, unrealized manufacturing capacity, lag‐time due to workstation events and exception handling can all...
應用材料公司的 Aera4 光罩檢測系統是以 193 奈米為主的第四代檢測工具；此工具獨特地結合了真實空間影像技術與尖端的高解析度影像技術。
Aera4 系統配備了新的微影級鏡頭，在標準的高解析度應用和空間檢測中展現更佳訊噪比，因而成為 1x...
應用材料公司的 Aeris?-G 系統是採用泵前電漿式廢氣處理解決方案，相比泵後廢氣處理裝置，此方案所處理的實際製程氣體量更少且濃度更高，因此使用的能量更少。在廢氣處理過程中，由於 Aeris-G 反應室中較低的氮容量，加上電漿分解，最多可將氮氧化物 (NOx)...
Aeris-Si 是下層前級管道清潔的整合解決方案，可用來管理二氧化矽負載並延長泵浦的使用壽命。該解決方案能達到高流量正矽酸四乙酯 (TEOS) 製程，實現最高沉積速率和產能；同時，泵浦的使用壽命可從 1 個月延長至 12 個月甚至更久，不到 1 年即可收回投資。...
Applied’s new AKT 55KS PECVD system brings market-leading precision plasma-enhanced chemical vapor deposition (PECVD) technology to...
With minimal mechanical motion the AKT EBT TFT array tester realizes high-reliability, low scheduled down time and low running cost. The...
Current inline automated optical defect inspection tools for displays are not as effective as scanning electron microscopy (SEM)...
As a fully automated vertical in-line sputtering system, the NEW ARISTO provides the highest throughput in the industry. Automated...
A state-of-the-art capacitive touch panel consists of multiple silicon dioxide (SiO2) indium tin oxide (ITO) metal and metal alloy films...
AKT-PECVD systems offer processes for both amorphous silicon (a-Si) and metal oxide (MOx) backplane technologies. Available films...
The AKT-PiVot 55K DT PVD and 25K DT PVD systems deposit critical film layers that create TFTs and interconnects on 2200mm x 2500mm and...
The Applied AKT-PX family of PECVD systems deposits highly-uniform low temperature polysilicon (LTPS) films on glass substrates from 1.6...
SmartFactory Rx Analytics & Control increases yield, prevents deviations, and assures quality.
Based on the proven technology of APF RTD?, the potential to produce more with the same equipment and personnel, while doing it in a...
HeadSmart 是 CMP 拋光頭換新服務的?Total Kit Management??(全面套件管理) 解決方案，綜合提供清潔、零件更換、再裝配和測試等服務。HeadSmart 可確保 CMP 拋光頭以最高品質換新，進而提高設備效能。
Ginestra? is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...
Based on more than 35 years of experience with electron beam web coating and sputtering web coating, the TopBeam? 1100S system combines...
A wide variety of different metals and oxides can be evaporated with Applied’s high-power electron beam evaporation. This process offers...
The TopCoil? platform complements Applied Materials’ evaporation portfolio with induction heated crucible technology. This is a solution...
