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The expanding use of MEMS devices, including accelerometers, gyroscopes and microphones, is a major contributor to the ongoing transformation of the mobile, automotive and medical device markets. Adoption is further accelerating with the development of multi-function or “combo” sensor packages smaller MEMS device footprint enables additional capability in a similar form-factor. New materials and device integration schemes are required to enable these combo devices. These include a need to deposit and etch thick epi to enable power reduction and…

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